| Data still to be completed------(<---links) | |
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| PRODUCT DATA of Sn63Pb37 |
| Material | Sn63Pb37 |
| General Information | Soft Solder eutectic Sn63 Space quality |
| Product Type | Wire, Bar and Flux-cored Wire |
| Chemical Composition | 63% Sn, 37% Pb |
| Name of Manufacturer | ELSOLD GmbH & Co. KG
Hüttenstraße 1 D-38871 Ilsenburg, Deutschland Phone:+49 39452 48 79 12 Fax:+49 39452 48 79 66 E-Mail: O.Kroll@elsold.de Web: www.elsold.de |
| EXPERIENCE IN PRACTICE |
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| Development Status | Commercial Product |
| Cost Range | Low |
| Lot Reproducibility | Excellent |
| Equivalent Designations | 63 Tin Solder, S--Sn63 Pb37 E |
| Space Experience | Good |
| PHYSICAL PROPERTIES |
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| Specific Gravity | 8.5 @ Room Temperature |
| ELASTIC PROPERTIES |
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| Tensile Modulus | 16.1 to 20.6 GPa Remark:Room temperature data from Cryogenics 48 (2008) 497-510 |
| Poisson Ratio | 0.4 |
| ELECTRICAL PROPERTIES |
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| Electrical Volume Resistivity | 0.00000145 ohm.m |
| Electrical Conductivity | 11.9 %IACS |
| THERMAL PROPERTIES |
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| Temperature Range | 80 °C(maximum) Remark: Suitable for extensive periods at +80°C or short periods to a maximum of +120°C. |
| Thermal Conductivity | 50.9 W/m.K |
| Thermal Expansion Coefficient | 16 μstrain/°C @ Room Temperature |
| Melting Range | 183 C |
| RELEVANT PROPERTIES FOR USE IN SPACE COMMUNITY |
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| Thermal Cycling | Test programme showed no electrical failures after 1000 cycles. Test:Joints made to ECSS-Q-70-08 requirements; -60°C to +80°C under vacuum with DT of 10°C/min. |
| Temperature Range(space) | Suitable for extensive periods at +80°C or short periods to a maximum of +120°C. |
| SPECIAL RECOMMENDATIONS |
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| Special Recommendations | Mandatory for the assembly of components on printed circuit boards (ECSS-Q-70-08). Not recommended against silver and/or gold |