| Data still to be completed------(<---links) | |
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| PRODUCT DATA of CDA 353 |
| Material | CDA 353 |
| Product Type | Metal Alloy |
| Chemical Composition | 40% Zn, 2% Pb, Rem. Cu |
| Name of Manufacturer | H. Rollet & Co. Ltd. |
| EXPERIENCE IN PRACTICE |
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| Development Status | Commercial Product |
| Cost Range | Very Low |
| Equivalent Designations | C35300; CuZn37Pb2; CW606N; CZ119, CuZn40Pb2, CZ120; CDA353; Brass (a-b) Leaded |
| Space Experience | Good |
| PHYSICAL PROPERTIES |
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| Specific Gravity | 8.4 |
| ELASTIC PROPERTIES |
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| Tensile Modulus | 103 GPa |
| ELECTRICAL PROPERTIES |
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| Electrical Volume Resistivity | 6.63e-8 ohm.m |
| THERMAL PROPERTIES |
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| Thermal Conductivity | 117 W/m.K |
| Thermal Expansion Coefficient | 20.9 µstrain/°C |
| Melting Range | 885 to 910 °C |
| Specific Heat | 0.377 J/g.K |
| RELEVANT PROPERTIES FOR USE IN SPACE COMMUNITY |
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| Atmospheric Corrosion | The resistance to atmospheric corrosion is fair. The material is generally plated for protection. |
| Stress Corrosion Status | Low Resistance to SCC: Table 3
Remark: Not for primary structural items Remark: in the 50% cold rolled condition only Remark: acc. to ECSS-Q-ST-70-36C Data Quality: Design Data |
| SPECIAL RECOMMENDATIONS |
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| Special Recommendations | When this material is used for PCB terminals (machined), there must be a Copper or Nickel diffusion barrier (3microns) between the solder coating and the brass,(See: ECSS-Q-70-08). For swaged terminals, the lead-free variety should be used. · Resistance to stress corrosion is low when the material is 50% cold rolled. Furthermore, it should not be used in stressed conditions. See ECSS-Q-70-36 for alternative copper alloys with high resistance to stress corrosion. |