OUTGASSING DATA of EPO-TEK T7109 A/B AS 10/1 BW THERMALLY COND EPOXY |
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Manufacturer | Epoxy Technology |
Product_Type | COND ADHESIVE |
Cure | 2H/25/AIR+6H/125/AIR+21H/60/AIR |
Result | TML=1.30%; RML=1.02%; CVCM=0.08% |
Reference | GSC25849 / 1998 / NASA Outgassing database |