OUTGASSING DATA of ME 7156 TI AL FILLED THERM COND ADHESIVE
ManufacturerAI Technology Inc.
Product_TypeCOND ADHESIVE
Cure1H/25/E-1+4H/85/E-1+2H/75/E-1+100H/100/AIR
ResultTML=0.35%; RML=0.23%; CVCM=0.12%
ReferenceGSC24786 / 1997 / NASA Outgassing database