OUTGASSING DATA of ME 7156 TI AL FILLED THERM COND ADHESIVE |
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Manufacturer | AI Technology Inc. |
Product_Type | COND ADHESIVE |
Cure | 1H/25/E-1+4H/85/E-1+2H/75/E-1+100H/100/AIR |
Result | TML=0.35%; RML=0.23%; CVCM=0.12% |
Reference | GSC24786 / 1997 / NASA Outgassing database |