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| PRODUCT DATA of Stycast 2850 |
| Material | Stycast 2850 |
| Product Datasheet | stycast2850 |
| General Information | Thermally Conductive Epoxy Encapsulant |
| Processing and Assembly | To be used with: catalyst 9 or catalyst 11 or catalyst 24LV |
| Product Type | 2-part potting resin. |
| Chemical Composition | Epoxy |
| Name of Manufacturer | Emerson & Cumming
Nijerheidsstraat 7, B-2260 Westerlo, Belgium +32 14 56 25 00 +32 14 56 25 01 www.emersoncuming.com |
| EXPERIENCE IN PRACTICE |
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| Development Status | Commercial Product |
| Cost Range | Low |
| Lot Reproducibility | Excellent |
| Space Experience | Extensive |
| PHYSICAL PROPERTIES |
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| Specific Gravity | 2.3 Data Quality: Manufacturer's data |
| Viscosity | 70000 cP Data Quality: Manufacturer's data |
| Pot Life | 45 min Data Quality: Manufacturer's data |
| ELECTRICAL PROPERTIES |
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| Electrical Volume Resistivity | 5e12 ohm.m @ 25 °C |
| Loss Factor | 0.02 @ 60 Hz. |
| Dielectric Constant | 6.5 @ 60 Hz. |
| Dielectric Strength | 15 kV/mm Data Quality: Manufacturer's data |
| THERMAL PROPERTIES |
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| Thermal Conductivity | 1.44 W/m.K @ 25 °C |
| Thermal Expansion Coefficient | 29 μstrain/°C Data Quality: Manufacturer's data |
| RELEVANT PROPERTIES FOR USE IN SPACE COMMUNITY |
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| Flammability | Pass (23.8% O2) Test: NASA NHB 8060-1B |
| Toxicity/Offgassing | Pass Test: NASA NHB 8060-1A |
| Temperature Range(space) | Up to 205°C Test: Manufacturer’s Data |
| Outgassing | TML = 0.38%, RML =0.24%, CVCM = 0.01% Test: ECSS-Q-70-02 |
| Oxygen Index | 29.8 Test: ECSS-Q-70-21 |
| Water Absorption | < 0.15% Test: Over 7 days |
| SPECIAL RECOMMENDATIONS |
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| Special Recommendations | Recommended cure is 24 hours at room temperature, plus 4 hours at 60°C with catalyst 9. · Other catalysts are available for the same resin, but these will affect the properties: Catalyst 11 for high-temperature cure; Catalyst 24 LV for low viscosity. Some experience in space is available for both. · A derived resin (2850 KT) can be used for extremely high thermal conductance (4.2 W/m.K). |